Specialize in the manufacturing of PRINTED CIRCUITS BOARDS - having factory in Singapore and China for prototyping and High/low volume , High Mix models.
Single , Double sided plated thru holes , Hybrid and Multilayer Rigid PCB up to 20 layers.
Flexible Circuits Boards- Single , Double -sided and 6 layer.
Specialize also in PAD's Over Vias, High Frequency materials (Rogers, Taconic, Nelco) and Edge Plating Technology.
Impedance control and Differential control P.C.B
P.C.B- Layout and Design from electronics schematic.
P.C.B- Assembly , turn-key.


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Capabalities


PROCESS CAPABILITIES
  • Minimum line width and space 0.08mm and 0.08 ( 3/3 mils)
  • Minimum drill hole size 0.15 mm Blind holes 0.15 mm
  • Minimum via hole diameter 0.10 mm
  • Minimum annular ring size 0.125
  • Minimum controlled Nickel : 350 u inch / Minimum Controlled Gold : 50 u inch.
  • Minimum laminate thickness 0.1 mm / 35 mm copper.
  • Blind and Buried Via.
  • Differential and Impedance Control.
  • High T.G. material.
  • Halogen and lead free manufacturing environment.
  • PAD's Over Vias.
  • PLASMA Etch Capabilities.
  • Edge Plating Capabilities.
MATERIALS PROCESSING FORMAT
  • Panel form manufacturing process.
  • Minimum panel size 180 X 100mm
  • Maximum panel size 480 X 610mm
  • COMPUTER AIDED DESIGN
  • CAD Software   - GC-CAM
  • CAD Format     - Gerber, DXF, Protel Files
COMMUNICATION CAPABILITY
  • Managing Director : This e-mail address is being protected from spambots. You need JavaScript enabled to view it
  • Web-Portal : www.circuitimageonline.com.sg
MATERIALS
  • Substrate -- FR-1, FR2, FR-4, FR-5, CEM-1, CEM-3, Polymide.
  • ROGERS (High Frequency) & Teflon Materials (Low D.K), Nelco and Taconic.
  • Flexi Material, (Polyimide, Polyester)
PLATING
  • Acid Copper
  • Nickel
  • Hard Gold
  • Bondable Gold / Soft Gold
FINISH
  • Hard and Bondable Gold
  • Hot air leveled Solder coat / Hot Air Lead Free.
  • Anti tarnish bare copper, OSP
  • Flux coating
  • Immersion Tin
  • Immersion Silver
  • Immersion Gold
  • Pls refer to : This e-mail address is being protected from spambots. You need JavaScript enabled to view it ; Tel : +65 96317176