PROCESS CAPABILITIES
- Minimum line width and space 0.08mm and 0.08 ( 3/3 mils)
- Minimum drill hole size 0.15 mm Blind holes 0.15 mm
- Minimum via hole diameter 0.10 mm
- Minimum annular ring size 0.125
- Minimum controlled Nickel : 350 u inch / Minimum Controlled Gold : 50 u inch.
- Minimum laminate thickness 0.1 mm / 35 mm copper.
- Blind and Buried Via.
- Differential and Impedance Control.
- High T.G. material.
- Halogen and lead free manufacturing environment.
- PAD's Over Vias.
- PLASMA Etch Capabilities. Quality Management System 9001:2015
- Edge Plating Capabilities. PCB & PCBA
MATERIALS PROCESSING FORMAT 
- Panel form manufacturing process.
- Minimum panel size 180 X 100mm
- Maximum panel size 480 X 610mm
- COMPUTER AIDED DESIGN
- CAD Software - GC-CAM
- CAD Format - Gerber, DXF, Protel Files
COMMUNICATION CAPABILITY
- Managing Director :
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- Web-Portal : www.circuitimageonline.com.sg
MATERIALS
- Substrate -- FR-1, FR2, FR-4, FR-5, CEM-1, CEM-3, Polymide.
- ROGERS (High Frequency) & Teflon Materials (Low D.K), Nelco and Taconic.
- Flexi Material, (Polyimide, Polyester)
PLATING
- Acid Copper
- Nickel
- Hard Gold
- Bondable Gold / Soft Gold
FINISH
- Hard and Bondable Gold
- Hot air leveled Solder coat / Hot Air Lead Free.
- Anti tarnish bare copper, OSP
- Flux coating
- Immersion Tin
- Immersion Silver
- Immersion Gold
- Pls refer to :
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; Tel : +65 96317176
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